Company News

IC design house APEC and wafer foundry AMPI sign strategic agreement

2009/2/6

On December 30, 2008, Taiwan-based IC design house Advanced Power Electronics Corporation (APEC) and the foundry service company Advanced Microelectronic Products (AMPI) announced an agreement for a strategic alliance to be implemented through a share swap, in order to strengthen cooperation on the production of power MOSFETs, power discrete and power IC devices.

The share swap took place on February 2, 2009, as agreed, with one APEC share exchanged for 2.48 AMPI shares. APEC issued 7.3 million new shares in exchange for a total of 18.104 million shares released by four of AMPI's major shareholders. The 7.3 million APEC shares account for 5.5% of APEC's expanded capital.

The emerging market for energy saving represents a huge demand for power devices including discretes and ICs. This alliance will significantly help both companies to enrich their deployment of power devices to this important market as well as increase their market share. This implementation of a virtual IDM model will also bring more efficiency through vertical integration in the development and production of these products. The partnership is expected to provide substantial value to both parties.

IC design house APEC goes Green

2008/1/1

As part of its commitment to responsible manufacturing and a clean environment, Taiwan-based IC design house Advanced Power Electronics Corporation (APEC) continues to expand the number of products it offers that are produced with a halogen-free (HF) molding compound. All of its products have been Pb-free and RoHS-compliant for several years and many products that will be introduced in 2008 will also be halogen free.
The halogen-free products from APEC are compliant with the requirements of IEC61249-2-21, JPCA-ES01 2003, and IPC1401. Maximum halogen levels are well below the required limits of <900pmm chlorine (Cl), <900ppm bromine (Br), and <1500ppm total halogens.
APEC is continuing to support its existing products in non-HF molding compound, but these are also now available with HF molding compound as a requested option, identified by HF in the part number. Samples and appropriate documentation are available where re-qualification is necessary.

New Record Highs in September 2005

2005/10/7

APEC`s monthly sales revenue hits record high of NT$ 380M (US$11.5M), reflecting YoY growth of 95.55%.

Licensing Agreement with IR

2005/5/13

APEC has entered an agreement with International Rectifier Corporation to license patents of planar, polygonal technology used in MOS and IGBT.

APEC's March 2005 sales revenue reached a record high of NT$ 254.4M (US$ 8.08M).

2005/4/8

March 2005 sales revenue reached a new monthly record at NT$ 254.4 M (US$ 8.08M), which represents a growth of 52.99% compared with March 2004. Q1 2005 consolidated revenue reached NT$ 580.0M (US$ 18.4M) with an annual growth rate of 22.01%.

Sales revenue

Year 2005

Year 2004

Growth rate (%)

March

NT$ 254.4M

(US$ 8.08M)

NT$ 166.3M

(US$ 5.28M)

52.99%

Q1

NT$ 580.0M

(US$ 18.4M)

NT$ 475.4M

(US$ 15.1M)

22.01%

APEC's operating income continues to grow

2004/11/16

Operating income continues to grow. In October 2004, monthly consolidated revenue reached NT$ 217.0M (US$ 6.88M), growing 12.23% from the previous month, and 34.34% year-on-year. Sales revenue from January till October totalled NT$ 1.635B (US$ 51.9M), a tremendous increase of 33.66% year-on-year.