Company News

Advanced Power Electronics Corp Announces New GreenFET Packages Using DirectFET Packaging Technology

2009/8/9

HSINCHU, Taiwan August 9, 2009 Advanced Power Electronics Corporation, a leading manufacturer of MOS power semiconductors for DC-DC power conversion applications, confirmed today that it has products in qualification in the new GreenFET? packages using the DirectFET advanced power management packaging technology licensed from International Rectifier.  Designed for use in AC-DC and DC-DC power conversion applications in computers, notebooks, telecommunications and consumer electronics devices, these surface-mount power packages offer extremely efficient cooling for Power MOSFET chips in an SO-8 footprint or smaller. Unlike standard plastic discrete packages, the GreenFET? metal can construction enables dual-sided cooling to significantly increase the current handling capacity in high frequency DC-DC buck converters.
 
Since obtaining the license from IR, Advanced Power Electronics Corporation has been packaging and testing its latest generation of MOSFET chip technology in both small and medium size GreenFET? power packages to ensure compatibility and long-term reliability. The company expects to sample the first products in both size GreenFET? packages within the next 60 to 90 days. These will be physically identical in terms of pad layout and board footprint to the corresponding SQ, ST, MP and MX DirectFET packages.

VP of IRs Enterprise Power business unit, Tim Phillips said, "IRs DirectFET package technology is increasingly the preferred solution to reduce energy losses while shrinking the design footprint in advanced computing, consumer and communications applications.  This license agreement with APEC, along with one other previously announced agreement, serves to secure supply worldwide for the customer demand of this industry leading package. He added We are continually developing leading-edge technology to save energy and, through licensing agreements, we can broaden the energy-saving impact made possible with innovations such as DirectFET, further expanding our presence in the largest segment of the power management market."

Advanced Power Electronics Corporation has dramatically expanded its advanced power MOSFET product range with our GreenFET? packages, while building on our long term relationship with IR, stated Eric Kwat, President of Advanced Power Electronics Corp. By combining our latest MOSFET chip technology with this important package option, we now offer our customers broader choices to achieve both energy and cost-efficient solutions for their applications, whilst minimizing any environmental impact thanks to a RoHS-compliant, halogen-free green package. Our latest MOSFET devices have extremely low figure of merit combining excellent on-resistance with fast switching performance, and coupled with the GreenFET? s double-sided cooling capability, they will enhance our position as one of the leading suppliers of MOSFET products.

About Advanced Power Electronics Corporation
Established in Taiwan in 1998, Advanced Power Electronics Corporation has become a leading supplier of MOS power discretes and ICs which enable cost-effective efficient solutions for new and existing power applications. It was ranked as one of the worlds top fifteen power transistor suppliers by iSuppli. For more information, contact the company or visit the company's Web site at www.a-power.com.tw

Patent and Trademark Notice
DirectFET and IR are registered trademarks of International Rectifier Corporation.
GreenFET? is a trademark of Advanced Power Electronics Corp.

Contacts:
 
Americas, Europe, Middle East:  
 
Ralph Waggitt, +1 (408) 717-4558
rwaggitt@a-powerusa.com   

Asia:
   
Eric Kwat
May Tan
Tel: +886-2-28838258
Fax: +886-2-28814528
Email: investinfo@a-power.com.tw

IC design house APEC and wafer foundry AMPI sign strategic agreement

2009/2/6

On December 30, 2008, Taiwan-based IC design house Advanced Power Electronics Corporation (APEC) and the foundry service company Advanced Microelectronic Products (AMPI) announced an agreement for a strategic alliance to be implemented through a share swap, in order to strengthen cooperation on the production of power MOSFETs, power discrete and power IC devices.

The share swap took place on February 2, 2009, as agreed, with one APEC share exchanged for 2.48 AMPI shares. APEC issued 7.3 million new shares in exchange for a total of 18.104 million shares released by four of AMPI's major shareholders. The 7.3 million APEC shares account for 5.5% of APEC's expanded capital.

The emerging market for energy saving represents a huge demand for power devices including discretes and ICs. This alliance will significantly help both companies to enrich their deployment of power devices to this important market as well as increase their market share. This implementation of a virtual IDM model will also bring more efficiency through vertical integration in the development and production of these products. The partnership is expected to provide substantial value to both parties.

IC design house APEC goes Green

2008/1/1

As part of its commitment to responsible manufacturing and a clean environment, Taiwan-based IC design house Advanced Power Electronics Corporation (APEC) continues to expand the number of products it offers that are produced with a halogen-free (HF) molding compound. All of its products have been Pb-free and RoHS-compliant for several years and many products that will be introduced in 2008 will also be halogen free.
The halogen-free products from APEC are compliant with the requirements of IEC61249-2-21, JPCA-ES01 2003, and IPC1401. Maximum halogen levels are well below the required limits of <900pmm chlorine (Cl), <900ppm bromine (Br), and <1500ppm total halogens.
APEC is continuing to support its existing products in non-HF molding compound, but these are also now available with HF molding compound as a requested option, identified by HF in the part number. Samples and appropriate documentation are available where re-qualification is necessary.

New Record Highs in September 2005

2005/10/7

APEC`s monthly sales revenue hits record high of NT$ 380M (US$11.5M), reflecting YoY growth of 95.55%.

Licensing Agreement with IR

2005/5/13

APEC has entered an agreement with International Rectifier Corporation to license patents of planar, polygonal technology used in MOS and IGBT.

APEC's March 2005 sales revenue reached a record high of NT$ 254.4M (US$ 8.08M).

2005/4/8

March 2005 sales revenue reached a new monthly record at NT$ 254.4 M (US$ 8.08M), which represents a growth of 52.99% compared with March 2004. Q1 2005 consolidated revenue reached NT$ 580.0M (US$ 18.4M) with an annual growth rate of 22.01%.

APEC's operating income continues to grow

2004/11/16

Operating income continues to grow. In October 2004, monthly consolidated revenue reached NT$ 217.0M (US$ 6.88M), growing 12.23% from the previous month, and 34.34% year-on-year. Sales revenue from January till October totalled NT$ 1.635B (US$ 51.9M), a tremendous increase of 33.66% year-on-year.