Support

Technical Support Contact

For technical support, please contact our international support team on: support@a-power.com.tw.

FAQ

Q: Do all APEC products comply with the RoHS lead-free requirement?

A: Yes. APEC have already prepared many of its products to comply with RoHS, and any products with lead can be changed to meet your lead-free requirements.

Q: Why call it GreenFET?

A: This package offers not only a Green package, both RoHS-compliant and halogen/BFR free, but also supports current industry initiatives aimed at improved efficiency in power conversion applications, reducing system power consumption and therefore carbon footprint.

Q: What are the planned GreenFET package sizes?

A: APEC plans to introduce four package types initially in small (SQ, ST) and medium (MP, MX) package sizes.

Q: Are they mechanically identical to the packages available from IR?

A: The packages are identical in terms of pad layout and circuit board footprint. Electrical specifications of individual GreenFET MOSFET products may differ.

Q: Is there currently any direct competition to the GreenFET package(s)?

A: Only from licensed products based on DirectFET technology.

Q: How does the GreenFET package provide dual-sided cooling instead of only one-sided cooling like typical power packages? What was the enabling technology that made this possible?

A: The GreenFET  is a kind of “flip-chip?package with the “bottom?side of the die directly attached to the underside of the top-side metal can, allowing excellent thermal conduction from the chip through the can to a top-side heat sink. The connections on the “top?side of the chip are soldered down directly to the circuit board using proprietary metallization and passivation processes.

Q: What is the downside to dual-sided cooling?

A: Clearly, the dual-side cooling configuration requires more careful control of the board assembly process to ensure correct three-dimensional alignment of the DirectFET. However, any increase in cost is offset by the significant improvement in system performance and efficiency which this technology provides.

Q: What are the first APEC products that will be offered in the GreenFET package? What are the targeted applications and markets?

A: APEC is proceeding with the qualification of several 30V low Rds(on) MOSFET products in the various package sizes, aimed at the DC-DC converter and server markets.

Q: Are the two companies planning to co-market any Power MOSFET products in the GreenFET/DirectFET packages?

A: The licensing agreement covers only the packaging technology. There are currently no plans for co-marketing any specific MOSFET products in the GreenFET package.

Q: How long have APEC and IR been working together? What other programs have they collaborated on?

A: APEC and IR have worked together for a number of years and APEC is an IR licensee for some planar, polygonal technology used in MOS and IGBT products, for a series of power management IC products, and for DirectFET advanced packaging technology.