Index > Q&A
Q: How does the GreenFET package provide dual-sided cooling instead of only one-sided cooling like typical power packages? What was the enabling technology that made this possible?

A: The GreenFET  is a kind of “flip-chip?package with the “bottom?side of the die directly attached to the underside of the top-side metal can, allowing excellent thermal conduction from the chip through the can to a top-side heat sink. The connections on the “top?side of the chip are soldered down directly to the circuit board using proprietary metallization and passivation processes.